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Product Detail

REFINE Series

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Product parameters
ModelREFINE-XS
Inspection Module
Camera Specification5M High-frequency Industrial Camera, High Frame Number (Factory Setting); 12M Option
Pixel20μm, 15μmꢀ(Factory Setting)
FOV(single field of view) Range40×40 mm, 30×30 mm (Factory Setting)
LEDRGB + TOP
Light Source0 – 550 μm
Height Inspection Resolution0.36 μm
Height Inspection Accuracy1μm (Based on the actual solder paste/calibration block)
Inspection ItemVolume, Area, Height, X/Y Position, Bridging, Shape, etc
Defective TypeExcessive/Insufficient/Missing paste,Bridge,2D & 3D Paste displacement, Shape deformity, Dust, etc
Repeatability (Volume, Area, Height)<1% @3sigma
GR & R (Gauge Reproducebility and Repeatability)< 10% (@6sigma tolerance = +/- 50%)
Inspection Speed0.35Sec / FOV
Conveyor & PCB Size
Max PCB Size460×410 mm
Min PCB Size50×50 mm
PCB Up-Clearance30 mm
PCB Bottom-Clearance30 mm
PCB Thickness0.5-5 mm
Max PCB Warpage±3 mm
PCB Transfer Height2.5mm
PCB Transfer Height900±20 mm
Max PCB Weight5KG
Frame & Others
Base & FrameIntegra1 steel casmting frame; firmly, ensure high accuracy of inspection
Dimensions and Weight947x1321x1600mm (W x D x H) 950KG
Power SupplyAC 220V 1Φ 50/60Hz
Power2.2KW
Communication InterfaceSMEMA
Air Supply4-6bar，5L/min
Operating Condition5-40℃, 15-90% RH
Options
1. BarcodeReader4. Repair Station (PC)
2. 3D Calibration Target5. Infared Muti-touch LCD + Voice Control
3. 2D Calibration Glass6. Offline Editing Software (License Key)
The above contents are subject to change without further notice!


Product Description

● 3D solder paste inspection based on white-lightsine stripe PMP technology;
● Solder paste height inspection accuracy reaches 1 um;
● Auto-restore pad 3D data on PCB surface, calculate thevolume, area, height and deviation of every solder 
● Multi-direction,multi-angle 3D PMP inspection;
● Vivid and easy to used graphic interaction interface, comprehensive function and easy to handle;
● In addition to programming with Gerber file, image-oriented edit mode can also realize off-lineprogramming and debugging;
● Multi-touch function can realize 3D image rotationand 2D image resizing, convenient to check and confirm solder paste condition;
● Comprehensives SPC function includes manykind of diagrams generation and output;
● Image accelerate calculations base on multi-GPU;
● Integrated cast iron frame structure, highrigidity can avoid outside vibration 

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